This technology will use several extreme ultraviolet (EUV) masks, which can further enable more competitive speed, power reduction, and logic density. We have already taped out more than 10 customer products at 7nm in 2017and a total of more than 50 customer product tape-outs are expected by the end of 2018.ħnm FinFET Supports Various Customer Product Applications 7nm FinFET Plus Technology Risk Production Starts Soonįollowing the volume production of 7nm FinFET technology, TSMC's 7nm FinFET Plus technology is expected to start risk production in the third quarter of 2018. Fin field effect transistor (FinFET) is the newest technology compared to metal oxide semiconductor field effect transistors (FET), and we designed various structures of FinFETs as double-gate FETs, trigate FETs, and gate all around field effect transistor in nanometer technology using Silvaco TCAD tool. TSMC's 7nm technology supports customers for various product applications, covering mobile, artificial intelligence, server CPU, GPU, cryptocurrency, network processor, FPGA, gaming, and automotive. TSMC set another industry record by launching two separate 7nm FinFET tracks: one optimized for mobile applications, the other for high performance computing applications. In addition, this technology improves logic density by more than three times.ħnm Supports a Diverse Set of Product Applications and Enjoys Strong Customer Adoption 7nm is TSMC's fourth generation process node that uses 3D FinFET transistor technology, a further demonstration of TSMC's continued innovation that leads the semiconductor industry's technology development.ħnm Provides the Industry's Most Competitive Speed, Power Reduction, and Logic DensityĬompared to TSMC's 16nm FinFET Plus (16FF+) technology, TSMC's 7nm technology delivers around 35% speed gain at the same power, or around 65% power reduction at the same speed. TSMC's industry-first and leading 7nm Fin Field-Effect Transistor (FinFET) process technology entered volume production in the second quarter of 2018.
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